OFC/NFOEC is presented by:

ComSoc

Non-financial Technical
Co-sponsor:

Short Courses

SC175 Packaging of Optoelectronic, Photonic and MEMS Components

Sunday, February 24, 1:00 p.m. - 4:00 p.m.
Paul Haugsjaa; Polycision Inc., USA

Level: Beginner (No background or minimal training is necessary to understand course material)

Course Description
This Short Course provides an overview of the problems, current solutions, and future trends in photonic, optoelectronic, and MEMS component packaging. The course will cover those aspects of optics, device physics, and materials science required to understand valid packaging solutions and also to participate in the engineering of these solutions. The current art in packaging of optoelectronic components will be discussed, and examples of innovative packaging solutions that are beginning to be applied will be presented.

Benefits and Learning Objectives
This course should enable you to:

Intended Audience
This course will be useful for engineers who want to broaden their understanding of packaging technology management or wish to understand the issues involved in photonic component packaging development. Entrepreneurs and venture promoters looking to find the best packaging solution for their needs will also find the course useful.

Instructor Biography
Paul Haugsjaa is a principal consultant at Polycision Inc. He was the senior director of optical switching at Axiowave Networks, managed photonic and optoelectronic device development at Foster-Miller and served at GTE (Verizon) Labs as department manager for the solid-state technology and optoelectronic interconnects and packaging departments. His interests include novel hybrid optoelectronic integration, methods of precision alignment, new types of optical fiber fabrication, fiber lasers, advanced materials and precision manufacturing techniques as well as the development of MEMS components for electronic, photonic and biological applications.